Batch process fabrication of package-on-package microelectronic assemblies
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United States of America Patent
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May 31, 2016
Grant Date -
Mar 17, 2016
app pub date -
Nov 30, 2015
filing date -
Mar 31, 2014
priority date (Note) -
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Abstract
A microelectronic assembly can be made by joining first and second subassemblies by electrically conductive masses to connect electrically conductive elements on support elements of each subassembly. A patterned layer of photo-imageable material may overlie a surface of one of the support elements and have openings with cross-sectional dimensions which are constant or monotonically increasing with height from the surface of that support element, where the masses extend through the openings and have dimensions defined thereby. An encapsulation can be formed by flowing an encapsulant into a space between the joined first and second subassemblies.
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