Shielding structure of a through-hole formed in a wall of a plastic hollow product
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United States of America Patent
Stats
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Jun 7, 2016
Grant Date -
Sep 4, 2008
app pub date -
Jan 22, 2008
filing date -
Jan 22, 2007
priority date (Note) -
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Abstract
An improved structure for sealing a through-hole formed in a plastic hollow product when mounting a component such as a sensor on the product is provided. A cylindrical section is provided in a peripheral wall of the plastic hollow product as projecting radially outwardly from the peripheral wall and an inner circumferential surface of the cylindrical section defines the through-hole for communication between the interior and the exterior of the product. A sensor component is mounted with its sensor portion extending through the through-hole and an O-ring is disposed between the sensor portion and the inner circumferential surface of the cylindrical section which is backed by a component mounting member.
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- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
| Patent Owner | Address | |
|---|---|---|
| EXCELL CORPORATION | CHIBA-KEN |
International Classification(s)
Inventor(s)
| Inventor Name | Address | # of filed Patents | Total Citations |
|---|---|---|---|
| Nakagawa, Tatsuya | Matsudo, JP | 41 | 337 |
| Tamura, Takashi | Kumagaya, JP | 243 | 3048 |
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| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Dec 7, 2027 |
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| Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
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