Substrate treatment method
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United States of America Patent
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Jun 7, 2016
Grant Date -
Jul 12, 2012
app pub date -
Mar 21, 2012
filing date -
Oct 29, 2008
priority date (Note) -
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Abstract
A substrate treatment method employs a substrate holding unit, a gas ejection nozzle, and a gas supply unit. The substrate holding unit is configured to hold a substrate. The gas supply unit is configured to supply a gas to the gas ejection nozzle. The gas ejection nozzle is disposed to be positioned adjacent a center portion of the substrate held by the substrate holding unit. The gas ejection nozzle has a gas ejection port. The gas ejection nozzle is configured to eject the gas radially from the gas ejection port over the substrate held by the substrate holding unit to form a gas-flow for covering the substrate.
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