Dicing tape-integrated film for semiconductor back surface

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United States of America Patent

PATENT NO 9362156
APP PUB NO 20140175677A1
SERIAL NO

14188991

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Abstract

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The present invention provides a dicing tape-integrated film for semiconductor back surface, which includes: a dicing tape including a base material and a pressure-sensitive adhesive layer provided on the base material; and a film for flip chip type semiconductor back surface provided on the pressure-sensitive adhesive layer, in which the film for flip chip type semiconductor back surface contains a black pigment.

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Patent Owner(s)

  • NITTO DENKO CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Matsumura, Takeshi Osaka, JP 311 2847
Shiga, Goji Osaka, JP 50 207
Takamoto, Naohide Osaka, JP 90 411

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