Apparatus and method for embedding components in small-form-factor, system-on-packages
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United States of America Patent
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Jun 7, 2016
Grant Date -
Nov 1, 2012
app pub date -
Jul 5, 2012
filing date -
Dec 18, 2009
priority date (Note) -
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Abstract
According to various aspects of the present disclosure, an apparatus is disclosed that includes a small form factor mobile platform including a system-on-package architecture, the system-on-package architecture arranged as a stack of layers including: a first layer having a first conformable material; a second layer having a second conformable material; a third layer having a third material; and one or more electronic components embedded within the stack of layers, wherein the first conformable material, the second conformable material, or both are configured to allow high frequency signal routing.
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