Semiconductor device, method for manufacturing the same, circuit substrate, electro-optical apparatus, and electronic equipment
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United States of America Patent
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Jun 7, 2016
Grant Date -
Oct 1, 2015
app pub date -
Jun 16, 2015
filing date -
Dec 2, 2002
priority date (Note) -
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Abstract
A semiconductor device is provided with a plurality of protrusions which are made of a resin and which protrude higher than electrodes, and conductive layers which are electrically connected to the electrodes and which cover the top surfaces of the protrusions. A method for manufacturing the semiconductor device includes a step of applying a layer of the resin to the semiconductor device except for the electrodes, a step of patterning the conductive layers on the electrodes and the layer of the resin in accordance with the protrusions, and a step of removing the layer of the resin located between the conductive layers by the use of the patterned conductive layers as masks so as to form the protrusions.
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