Ceramic electronic component and method for manufacturing the same
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United States of America Patent
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Jun 7, 2016
Grant Date -
May 8, 2014
app pub date -
Jan 14, 2014
filing date -
May 27, 2010
priority date (Note) -
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Abstract
A ceramic electronic component includes a ceramic element assembly and external electrodes. The external electrodes are disposed on the ceramic element assembly. The external electrodes include an underlying electrode layer and a first Cu plating film. The underlying electrode layer is disposed on the ceramic element assembly. The first Cu plating film is disposed on the underlying electrode layer. The underlying electrode layer includes a metal that is diffusible in Cu and a ceramic bonding material. The metal that is diffusible in Cu is diffused in at least a surface layer in the underlying electrode layer side of the first Cu plating film.
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