Bonding composition

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United States of America Patent

PATENT NO 9365592
APP PUB NO 20150252060A1
SERIAL NO

14434901

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Abstract

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To provide a bonding composition where high joint strength can be obtained due to joining at a comparatively low temperature and under a pressureless condition, and, that is also equipped with thermal resistance that is difficult to cause a reduction of joint strength due to decomposition, deterioration and/or the like of a resin component at the time of an increase of an operating temperature, and to provide a bonding composition particularly containing metallic particles. A bonding composition containing inorganic metallic particles and organic components including unsaturated hydrocarbon and amine with 4 to 7 of carbon number

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Patent Owner(s)

Patent OwnerAddress
BANDO CHEMICAL INDUSTRIES LTD6-6 MINATOJIMA MINAMIMACHI 4-CHOME CHUO-KU KOBE-SHI 650-0047

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Shimoyama, Kenji Kobe, JP 40 368
Watanabe, Tomofumi Kobe, JP 32 228

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