Method for preparing low cost substrates
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United States of America Patent
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Jun 14, 2016
Grant Date -
Apr 9, 2015
app pub date -
Oct 4, 2013
filing date -
Oct 4, 2013
priority date (Note) -
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status (Latency Note)
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Abstract
A mask is formed over a first conductive portion of a conductive layer to expose a second conductive portion of the conductive layer. An electrolytic process is performed to remove conductive material from a first region and a second region of the second conductive portion. The second region is aligned with the mask relative to an electric field applied by the electrolytic process. The second region separates the first region of the second conductive portion from the first conductive portion. The electrolytic process is concentrated relative to the second region such that removal occurs at a relatively higher rate in the second region than in the first region.
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