Component mounting substrate and method of managing component mounting substrate

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 9370134
SERIAL NO

14099716

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Importance

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Abstract

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Provided is a method of managing a component mounting substrate that can be used in a roll-to-roll process, without breaking or deteriorating electronic components mounted thereon. In the method of winding, around a core, a flexible component mounting substrate on which a plurality of electronic components are mounted and managing the component mounting substrate as a roll, the roll is held such that the core of the roll is parallel to a vertical direction.

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Patent Owner(s)

  • NICHIA CORPORATION

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Omura, Shingo Sagamihara, JP 8 32

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