Resin molding apparatus and resin molding method
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United States of America Patent
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Jun 21, 2016
Grant Date -
Jul 5, 2012
app pub date -
Mar 10, 2010
filing date -
Mar 12, 2009
priority date (Note) -
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status (Latency Note)
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Abstract
A resin molding apparatus includes a pair of metal molds respectively arranged so as to be insulated from the ground with insulating materials, and a molding portion including the pair of metal molds and to which a resin material is provided. At least one metal mold of the pair of metal molds is provided with electrodes at two points flanking the molding portion. A high frequency current generator capable of applying high frequency current having a frequency of about 10 kHz or more is connected to the two electrodes.
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