Packaged device

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9372202
SERIAL NO

13618643

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Abstract

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A packaged device of one embodiment includes a device layer section, and first and second packaging members. The device layer section is one where a movable microdevice including a movable part and a terminal part is formed. The first packaging member is joined to the device layer section, and includes a wiring region provided at a position corresponding to the terminal part and a conductive plug extending through the wiring region. The second packaging member is joined to a side of the device layer section opposite the first packaging member.

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Patent Owner(s)

Patent OwnerAddress
DRNC HOLDINGS INC200 BELLEVUE PARKWAY SUITE 300 WILMINGTON DE 19809

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Inoue, Hiroaki Kawasaki, JP 220 2885
Katsuki, Takashi Kawasaki, JP 58 513
Nakazawa, Fumihiko Kawasaki, JP 63 1326

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