High frequency interconnect structures, electronic assemblies that utilize high frequency interconnect structures, and methods of operating the same

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United States of America Patent

PATENT NO 9372214
SERIAL NO

13484548

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Abstract

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High frequency interconnect structures, electronic assemblies that utilize high frequency interconnect structures, and methods of operating the same. The high frequency interconnect structures include a plurality of dielectric waveguides and are configured to communicatively connect a plurality of transmitters with a plurality of receivers and to convey a plurality of signals therebetween. The plurality of signals may include a plurality of electromagnetic waves and may have a frequency of at least 200 GHz. The high frequency interconnect structures further may be configured to decrease a potential for crosstalk between a first signal that is conveyed by a first dielectric waveguide of the plurality of dielectric waveguides and a second signal that is conveyed by a second dielectric waveguide of the plurality of dielectric waveguides, such as through control of a passband of the first dielectric waveguide relative to the second dielectric waveguide and/or the use of a crosstalk mitigation structure.

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Patent Owner(s)

  • CASCADE MICROTECH, INC.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Campbell, Richard L Portland, US 15 943
Gleason, K Reed Portland, US 49 1830
Jung, Kooho Beaverton, US 2 551
Smith, Kenneth R Beaverton, US 111 3321
Strid, Eric W Portland, US 33 2089

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