Systems and methods for providing wafer access in a wafer processing system

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United States of America Patent

PATENT NO 9373533
SERIAL NO

14141812

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Systems and methods for providing wafer access in a wafer processing system are disclosed herein. The methods may include docking a first wafer cassette on the wafer processing system and removing a selected wafer from the first wafer cassette with the wafer processing system. The methods further may include performing a process operation on the selected wafer with the wafer processing system and undocking the first wafer cassette from the wafer processing system while performing the process operation. The methods also may include docking a second wafer cassette (which may be the same as or different from the first wafer cassette) on the wafer processing system, inventorying the second wafer cassette with the wafer processing system, and/or subsequently placing the selected wafer in the second wafer cassette. The systems may include wafer processing systems that include a controller that is programmed to perform at least a portion of the methods.

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Patent Owner(s)

  • CASCADE MICROTECH, INC.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Fehrmann, Frank Priestewitz OT Basslitz, DE 11 27
Hirschfeld, Botho Dresden, DE 8 37
Kanev, Stojan Thiendorf OT Sacka, DE 44 174

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