Polymer member based interconnect
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jun 21, 2016
Issued Date -
N/A
app pub date -
Sep 17, 2014
filing date -
Sep 17, 2014
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
An interconnect (124) suitable for attachment of integrated circuit assemblies to each other comprises a polymer member (130), possibly dielectric, coated with a conductive material (144) which provides one or more conductive lines. In some embodiments, the conductive material covers a part, but not all, of the polymer member. In some embodiments, multiple conductive lines are formed on the polymer member. In some embodiments, the polymer member is conductive. Such interconnects replace metal bond wires in some embodiments. Other features are also provided.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully