INTEGRATED CIRCUIT BONDING WITH INTERPOSER DIE
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United States of America Patent
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Jun 21, 2016
Grant Date -
Jun 30, 2016
app pub date -
Dec 30, 2014
filing date -
Dec 30, 2014
priority date (Note) -
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status (Latency Note)
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Abstract
A method of bonding components is disclosed. One embodiment of such a method includes applying both heat and pressure to a stack of components that includes an interposer with a reduced degree of warpage. Reducing the distance between the interposer and a first component of the stack of the components until a spacer prevents further reduction of that space. Then, cooling the stack of components while the pressure is maintained such that the degree of warpage of the interposer remains reduced.
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