Multi-wire electrical discharge machining system, multi-wire electrical discharge machining apparatus, power supply device, multi-wire electrical discharge machining method, semiconductor substrate, solar cell substrate, substrate manufacturing system, and substrate manufacturing method
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United States of America Patent
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Jun 28, 2016
Grant Date -
Sep 5, 2013
app pub date -
Feb 26, 2013
filing date -
Mar 1, 2012
priority date (Note) -
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Abstract
A multi-wire electrical discharge machining system for slicing a workpiece into a thin leaf at intervals of a plurality of wires arranged together causes the wires arranged together to travel in the same direction and includes a power feed contact configured to collectively comes into contact with the traveling wires, a machining power supply portion configured to supply a machining power supply to the power feed contact, and an electrical discharge portion configured to electrically discharge a machining power supply in which the traveling wires comes into contact with the power feed contact to collectively supply power to the traveling wires to the workpiece, in which a resistance between the machining power supply portion and the power feed contact is smaller than a resistance between the power feed contact and the electrical discharge portion.
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