Electrically assisted chemical-mechanical planarization (EACMP) system and method thereof
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United States of America Patent
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Jun 28, 2016
Grant Date -
May 30, 2013
app pub date -
May 27, 2012
filing date -
Nov 24, 2011
priority date (Note) -
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Abstract
A novel polishing pad is described. The polishing pad includes a base plate, a main polishing body, a plurality of metal bottom portions, a positive electrode conductive wire and a negative electrode conductive wire. The main polishing body made from a non-conductive material and disposed on the base plate includes a plurality of cavities thereon. The metal bottom portions are disposed in the cavities with each of the cavities having one of the metal bottom portions therein. The positive electrode conductive wire electrically is connected to a positive electrode of a power supply. The negative electrode conductive wire electrically is connected to a negative electrode of the power supply. The positive electrode conductive wire and the negative electrode conductive wire alternatively pass through the base plate and connect to the metal bottom portions respectively.
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