Method for etching organic film
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United States of America Patent
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Jun 28, 2016
Grant Date -
Aug 20, 2015
app pub date -
Feb 18, 2015
filing date -
Feb 19, 2014
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Abstract
A method for etching an organic film 1 having a surface selectively protected by a hard mask layer 2, includes a partial etching process of etching the organic film 1 partly in a thickness direction of the organic film 1 by using a mixed gas containing a gas that anisotropically etches a silicon oxide film and a gas that isotropically etches the organic film without etching the silicon oxide film; and a deposition process of depositing a protective film 3 made of the silicon oxide film on side surfaces 12 and a bottom surface 11 of a recess 10 formed in the organic film in the partial etching process. The partial etching process and the deposition process is alternately performed multiple times.
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