Method of manufacturing a winding-type solid electrolytic capacitor package structure using a lead frame
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United States of America Patent
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Jun 28, 2016
Grant Date -
Dec 17, 2015
app pub date -
Aug 25, 2015
filing date -
Mar 18, 2013
priority date (Note) -
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Abstract
A winding-type solid electrolytic capacitor package structure includes a winding capacitor unit, a package body and a conductive unit. The winding capacitor has a winding body enclosed by the package body, a positive conductive lead pin having a cutting surface, and a negative conductive lead pin having a grinding surface. The conductive unit includes a positive conductive terminal electrically connected to the positive conductive lead pin and a negative conductive terminal electrically connected to the negative conductive lead pin. The positive conductive terminal has a first embedded portion enclosed by the package body and a first exposed portion exposed outside the package body. The negative conductive terminal has a second embedded portion enclosed by the package body and a second exposed portion exposed outside the package body. The first and the second exposed portions are extended along the outer surface of the package body.
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