Sensor package

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United States of America Patent

PATENT NO 9379033
APP PUB NO 20140197503A1
SERIAL NO

14218048

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A sensor package is disclosed. One embodiment provides a sensor device having a carrier, a semiconductor sensor mounted on the carrier and an active surface. Contact elements are electrically connecting the carrier with the semiconductor sensor. A protective layer made of an inorganic material covers at least the active surface and the contact elements.

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Patent Owner(s)

Patent OwnerAddress
INFINEON TECHNOLOGIES AGGERMAN NOE BE BERG NEUBIBERG BAVARIA

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Theuss, Horst Wenzenbach, DE 224 2886
Wombacher, Ralf Maxhuette-Haidhof, DE 17 87

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