Die stacks with one or more bond via arrays of wire bond wires and with one or more arrays of bump interconnects

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United States of America Patent

PATENT NO 9379074
SERIAL NO

14250317

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Abstract

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An apparatus relating generally to a die stack is disclosed. In such an apparatus, a substrate is included. A first bond via array includes first wires each of a first length extending from a first surface of the substrate. An array of bump interconnects is disposed on the first surface. A die is interconnected to the substrate via the array of bump interconnects. A second bond via array includes second wires each of a second length different than the first length extending from a second surface of the die.

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Patent Owner(s)

Patent OwnerAddress
INVENSAS CORPORATION3025 ORCHARD PARKWAY SAN JOSE CA 95134

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Katkar, Rajesh San Jose, US 220 4423
Uzoh, Cyprian Emeka San Jose, US 329 9032

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