Printed circuit boards for communications connectors having openings that improve return loss and/or insertion loss performance and related connectors and methods
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United States of America Patent
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Jun 28, 2016
Grant Date -
Jul 30, 2015
app pub date -
Jan 29, 2014
filing date -
Jan 29, 2014
priority date (Note) -
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Abstract
Printed circuit boards for communications connectors are provided that include a dielectric substrate formed of a first insulative material having a first dielectric constant. First and second pairs of input terminals and first and second pairs of output terminals are provided on the dielectric substrate. A first differential transmission line electrically connect the first pair of input terminals to the first pair of output terminals, and a second differential transmission line electrically connect the second pair of input terminals to the second pair of output terminals. The dielectric substrate includes an opening that is positioned between the conductive paths of the first differential transmission line, the opening containing a second insulative material having a second dielectric constant.
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