Method of manufacturing solid solution perforator patches and uses thereof

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9381680
APP PUB NO 20110121486A1
SERIAL NO

12994148

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Loading Importance Indicators... loading....

Abstract

See full text

Methods for fabricating and manufacturing solid solution perforators (SSPs) using sharp metal or glass needles and/or subsequent molding and use are described. The methods entail making microneedles by various precision machining techniques and micromold structures from curable materials. Various designs of patch, cartridge and applicator are described. Also described are methods for adjusting the microneedle mechanical strength using formulation and/or post-drying processes.

Loading the Abstract Image... loading....

First Claim

See full text

Family

Loading Family data... loading....

Patent Owner(s)

  • THERAJECT, INC.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kwon, Sung-Yun Fremont, US 20 902
Oh, Sea-Jin Palo Alto, US 1 32

Cited Art Landscape

Load Citation

Patent Citation Ranking

Forward Cite Landscape

Load Citation

Maintenance Fees

Fee Large entity fee small entity fee micro entity fee due date
11.5 Year Payment $7400.00 $3700.00 $1850.00 Jan 5, 2028
Fee Large entity fee small entity fee micro entity fee
Surcharge - 11.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge after expiration - Late payment is unavoidable $700.00 $350.00 $175.00
Surcharge after expiration - Late payment is unintentional $1,640.00 $820.00 $410.00