Microelectromechanical sensor with out-of-plane sensing and process for manufacturing a microelectromechanical sensor
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United States of America Patent
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Jul 5, 2016
Grant Date -
Aug 29, 2013
app pub date -
Feb 27, 2013
filing date -
Feb 28, 2012
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Abstract
A microelectromechanical sensor that in one embodiment includes a supporting structure, having a substrate and electrode structures anchored to the substrate; and a sensing mass, movable with respect to the supporting structure so that a distance between the sensing mass and the substrate is variable. The sensing mass is provided with movable electrodes capacitively coupled to the electrode structures. Each electrode structure comprises a first fixed electrode and a second fixed electrode mutually insulated by a dielectric region and arranged in succession in a direction substantially perpendicular to a face of the substrate.
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