Integrated circuit packaging system with molded laser via interposer and method of manufacture thereof

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9385066
SERIAL NO

14282598

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Abstract

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A method of manufacture of an integrated packaging system includes: providing a substrate; mounting an integrated circuit on the substrate; mounting an interposer substrate having an interposer pad on the integrated circuit; covering an encapsulant over the integrated circuit and the interposer substrate; forming a hole through the encapsulant aligned over the interposer pad; and placing a conductive connector on and in direct contact with the interposer pad.

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Patent Owner(s)

Patent OwnerAddress
STATS CHIPPAC PTE LTD5 YISHUN STREET 23 SINGAPORE 768442

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Song, Sungmin Inchon, KR 23 408
Yang, DeokKyung Hanam-si, KR 51 492
Yoon, In Sang Seoul, KR 32 472

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