Integrated circuit packaging system with surface treatment and method of manufacture thereof

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United States of America Patent

PATENT NO 9385100
SERIAL NO

14659905

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Abstract

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An integrated circuit packaging system, and a method of manufacture thereof, includes: an embedded trace substrate having bonding sites and traces embedded in a base material, an insulation layer on the traces, the insulation layer having a top surface coplanar with the top surface of the base material; and an integrated circuit die connected to the bonding sites.

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Patent Owner(s)

Patent OwnerAddress
STATS CHIPPAC PTE LTDSINGAPORE

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Bae, Hyunll Seoul, KR 1 1
Chi, HeeJo Yeoju-gun, KR 98 2705
Kim, YoungChul Youngin-si, KR 37 343
Lee, HeeSoo Anyang-si, KR 108 826
Lee, Hun Teak Seongnam-si, KR 24 111

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