Silver compound, silver ink and method for inkjet printing on flexible substrate using the same
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United States of America Patent
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Jul 12, 2016
Grant Date -
Apr 16, 2015
app pub date -
Jun 2, 2014
filing date -
Oct 16, 2013
priority date (Note) -
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Abstract
A silver compound having a silver complex structure composed of silver ion, 2,2,6,6-tetramethyl-3,5-heptanedionato, and diethylenetriamine is disclosed. A silver ink is prepared by the silver compound applied for inkjet printing of a flexible substrate. A method for inkjet printing of the flexible substrate comprises the steps of pre-heating the flexible substrate to the temperature of 60° C., inkjet printing the flexible substrate with the silver ink thereon, and heating the flexible substrate under a low temperature to form a thin film of silver conductive pattern thereon. The silver conductive pattern has excellent electrical conductivity and a resistance value proximate to that of a general silver slug.
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