Curable resin composition, composition for forming solder resist, dry film and printed wiring board, and laminate and process for preparing the same
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United States of America Patent
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Jul 12, 2016
Grant Date -
Aug 27, 2015
app pub date -
Sep 26, 2013
filing date -
Sep 28, 2012
priority date (Note) -
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Abstract
The present invention provides a curable resin composition that can provide a cured material excellent in insulation reliability while maintaining adhesiveness and provide a composition for forming a solder resist, a dry film and a printed wiring board, a laminate having a resin insulating layer excellent in insulation reliability while maintaining adhesiveness, a dry film for forming this and a process for preparing a laminate using the dry film. The curable resin composition contains (A) an imidazole-isocyanate adduct, (B) a carboxyl group-containing resin and (C) a thermosetting resin. The above laminate has a substrate and a plurality of resin insulating layers formed on the substrate, in which one of the plural resin insulating layers in contact with the substrate is a layer formed of the curable resin composition.
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