Inline inspection of the contact between conductive traces and substrate for hidden defects using white light interferometer with tilted objective lens
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United States of America Patent
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Jul 12, 2016
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app pub date -
Mar 28, 2014
filing date -
Mar 28, 2014
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Abstract
Embodiments include devices, systems and processes for using a white light interferometer (WLI) microscope with a tilted objective lens to perform in-line monitoring of both resist footing defects and conductive trace undercut defects. The defects may be detected at the interface between dry film resist (DFR) footings and conductive trace footing formed on insulating layer top surfaces of a packaging substrate. Such footing and undercut defects may other wise be considered “hidden defects”. Using the WLI microscope with a tilted objective lens provides a high-throughput and low cost metrology and tool for non-destructive, non-contact, in-line monitoring.
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