Photo-curable and thermo-curable resin composition, and dry film solder resist
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United States of America Patent
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Jul 12, 2016
Grant Date -
Feb 12, 2015
app pub date -
Feb 20, 2013
filing date -
Feb 20, 2012
priority date (Note) -
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Abstract
The present invention relates to a photo-curable and thermo-curable resin composition that can provide a dry film solder resist having a higher glass transition temperature and improved heat resistance reliability, and the dry film solder resist. Said resin composition may include an acid-modified oligomer including an iminocarbonate-based compound having a carboxy group (—COOH) and a photo-curable unsaturated functional group, a photo-polymerizable monomer having two or more photo-curable unsaturated functional groups, a thermo-curable binder having a thermo-curable functional group, and a photo-initiator.
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