Method for creating asymmetrical wafer

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United States of America Patent

PATENT NO 9390906
SERIAL NO

14073602

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Abstract

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The present invention consists of a method for imparting asymmetry to a truncated annular wafer by either rounding one corner of the orientation flat, or rounding one corner of a notch. This novel method of rounding corners impart a visual and/or tactile asymmetry which can be utilized by a person in order to differentiate between the two different sides of the wafer. This inventive wafer design and method for making an asymmetric wafer is especially useful in the field of semiconductor technology and may be used on sapphire crystal wafers or any other class of wafer.

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Patent Owner(s)

Patent OwnerAddress
RUBICON TECHNOLOGY INC900 E GREEN STREET BENSENVILLE IL 60106

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Matthews, Michael W Bonn, DE 3 11
Phatak, Sunil B Bensenville, US 3 11

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