Heat spreading substrate
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United States of America Patent
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Jul 12, 2016
Grant Date -
Aug 22, 2013
app pub date -
Feb 17, 2012
filing date -
Feb 17, 2012
priority date (Note) -
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Abstract
Heat spreading substrate. In accordance with an embodiment of the present invention, an apparatus includes a thermally conductive, electrically insulating regular solid, a first electrically conductive coating mechanically coupled to a first edge of the regular solid and a second electrically conductive coating mechanically coupled to a second edge of the regular solid. The first and the second electrically conductive coatings are electrically isolated from one another and the faces of the first electrically conductive coating, the second electrically conductive coating and the regular solid are substantially co-planar. The primary and secondary surfaces of the regular solid may be free of electrically conductive materials.
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