Adhesive film

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United States of America Patent

PATENT NO 9391293
APP PUB NO 20140110699A1
SERIAL NO

14142347

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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An adhesive film used to encapsulate an organic electronic diode (OED) is provided. The adhesive film may be useful in effectively preventing penetration of moisture into an encapsulated structure of the organic electronic diode when the organic electronic diode is encapsulated, and effectively performing the encapsulation process under moderate conditions without causing damage to the organic electronic diode during the encapsulation process.

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Patent Owner(s)

  • LG CHEM, LTD.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chang, Suk Ky Daejeon, KR 89 862
Cho, Yoon Gyung Daejeon, KR 64 435
Lee, Seung Min Daejeon, KR 227 1004
Shim, Jung Sup Daejeon, KR 45 342
Yoo, Hyun Jee Daejeon, KR 77 474

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