Heating plate with planar heater zones for semiconductor processing

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9392643
APP PUB NO 20140047705A1
SERIAL NO

14062216

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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An exemplary method for manufacturing a heating plate for a substrate support assembly includes forming holes in at least one sheet, printing a slurry of conductor powder, or pressing a precut metal foil, or spraying a slurry of conductor powder, on the at least one sheet to form the planar heater zones, the power supply lines, and power return lines. The holes in the at least one sheet are filled with a slurry of conductor powder to form power supply and power return vias. The sheets are then aligned, pressed, and bonded to form the heating plate.

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Patent Owner(s)

Patent OwnerAddress
LAM RESEARCH CORPORATIONFREMONT CA

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Benjamin, Neil East Palo Alto, US 54 2954
Comendant, Keith Fremont, US 49 2063
Gaff, Keith Fremont, US 29 1229
Singh, Harmeet Fremont, US 162 5106

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