Polishing method and polishing system

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United States of America Patent

PATENT NO 9393665
APP PUB NO 20120244785A1
SERIAL NO

13198729

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Abstract

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A polishing method and a polishing system are provided. By means of adjusting a rotational center of a polishing article corresponding to positions of a polishing pad or polishing pads, a polishing rate of the polishing article surface has a better uniformity, resulted from compensation of polishing rates at the rotational center of the polishing article.

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Patent Owner(s)

Patent OwnerAddress
POWERCHIP SEMICONDUCTOR MANUFACTURING CORPORATIONNO 18 LI-HSIN RD 1 HSINCHU SCIENCE PARK HSINCHU

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Te-Yang Hsinchu, TW 2 1
Chen, Ya-Ling Taichung, TW 21 222
Cheng, Jen-Feng Taichung, TW 1 1
Wang, Yu-Piao Hsinchu County, TW 26 116

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