Dual epoxy dielectric and photosensitive solder mask coatings, and processes of making same

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United States of America Patent

PATENT NO 9398699
APP PUB NO 20120318565A1
SERIAL NO

13595149

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Abstract

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A microelectronic device mounting substrate includes a bond pad with a side wall and an upper surface. A dielectric first layer is disposed on the mounting substrate and a solder mask second layer is disposed on the dielectric first layer. A uniform recess is disposed through the solder mask second layer and the dielectric first layer that exposes the portion of the bond pad upper surface.

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Patent Owner(s)

  • INTEL CORPORATION

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Bchir, Omar San Diego, US 13 31
Jomaa, Houssam Phoenix, US 32 261

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