Via in a printed circuit board

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United States of America Patent

PATENT NO 9398703
SERIAL NO

14281802

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A via in a printed circuit board is composed of a patterned metal layer that extends through a hole in dielectric laminate material that has been covered with catalytic adhesive material on both faces of the dielectric laminate material. The layer of catalytic adhesive coats a portion of the dielectric laminate material around the hole. The patterned metal layer is placed over the catalytic adhesive material on both faces of the dielectric laminate material and within the hole.

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Patent Owner(s)

Patent OwnerAddress
CATLAM LLC1108 W EVELYN AVE SUNNYVALE CA 94086

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Bahl, Kenneth S Saratoga, US 26 80
Karavakis, Konstantine Pleasanton, US 73 2085

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