Processes and apparatuses for manufacturing wafers
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United States of America Patent
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Aug 2, 2016
Grant Date -
Jan 30, 2014
app pub date -
Jul 30, 2013
filing date -
Jul 30, 2012
priority date (Note) -
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Abstract
The process for manufacturing wafers includes the steps of mounting an ingot as a work piece in a manner that permits rotation about a longitudinal axis of rotation and rotating the ingot about its longitudinal axis of rotation to permit a microwave device that generates an energized beam to penetrate an outer surface layer thereof. Furthermore, the process includes exfoliating the outer surface layer with the energized beam, removing the exfoliated outer surface layer from the ingot as a continuous planar strip and cutting the continuous planar strip into a wafer.
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