Printed circuit board structure

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United States of America Patent

PATENT NO 9408293
APP PUB NO 20150342021A1
SERIAL NO

14717240

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Importance

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Abstract

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The invention relates to a printed circuit board structure, which comprises a first body, a second body and a sleeve. The sleeve is arranged between and connected with the first body and the second body so as to generate a differential height between the first body and the second body. Via the differential height are solved the problems of insufficient probe stiffness and poor wafer-sort quality, which is caused by decreasing the probe diameter to adapt to miniaturized chips.

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Patent Owner(s)

Patent OwnerAddress
HERMES-EPITEK CORP14F NO 38 SEC 2 DUNHUA S RD DA-AN DIST TAIPEI CITY 106

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hung, Chien-Yao Hsin-Chu, TW 8 23

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