Computer systems having an interposer including a flexible material

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9412677
APP PUB NO 20070285884A1
SERIAL NO

11841351

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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Various embodiments of an interposer for mounting a semiconductor die, as well as methods for forming the interposer, are disclosed. The interposer includes flexible solder pad elements that are formed from a core material of the interposer, such that the interposer may absorb thermally induced stresses and conform to warped or uneven surfaces. Embodiments of electronic device packages including a semiconductor die mounted to and electrically connected to the interposer, as well as methods for forming the electronic device packages, are also disclosed. In one electronic device package, the semiconductor die is electrically connected to the interposer with wire bonds attached to a routing layer of the interposer. In another electronic device package, the semiconductor die is electrically connected to the interposer by bonding the semiconductor die to the flexible solder pad elements of the interposer in a flip-chip configuration. A computer system incorporating an electronic device package with an interposer according to the present invention is also disclosed.

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Patent Owner(s)

Patent OwnerAddress
U S BANK NATIONAL ASSOCIATION AS COLLATERAL AGENT100 WALL STREET SUITE 1600 NEW YORK NY 10005

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Lee, Teck Kheng Singapore, SG 74 1715

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