Apparatus and methods for molded underfills in flip chip packaging
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United States of America Patent
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Aug 9, 2016
Grant Date -
May 9, 2013
app pub date -
Nov 4, 2011
filing date -
Nov 4, 2011
priority date (Note) -
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status (Latency Note)
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Abstract
Methods and apparatus for a forming molded underfills. A method is disclosed including loading a flip chip substrate into a selected one of the upper mold chase and lower mold chase of a mold press at a first temperature; positioning a molded underfill material in the at least one of the upper and lower mold chases while maintaining the first temperature which is lower than a melting temperature of the molded underfill material; forming a sealed mold cavity and creating a vacuum in the mold cavity; raising the temperature of the molded underfill material to a second temperature greater than the melting point to cause the molded underfill material to flow over the flip chip substrate forming an underfill layer and forming an overmolded layer; and cooling the flip chip substrate to a third temperature substantially lower than the melting temperature of the molded underfill material. An apparatus is disclosed.
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