Making multilayer 3D capacitors using arrays of upstanding rods or ridges
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United States of America Patent
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Aug 9, 2016
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app pub date -
Jun 13, 2014
filing date -
Jun 13, 2014
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Abstract
In one embodiment, a method for making a 3D Metal-Insulator-Metal (MIM) capacitor includes providing a substrate having a surface, forming an array of upstanding rods or ridges on the surface, depositing a first layer of an electroconductor on the surface and the array of rods or ridges, coating the first electroconductive layer with a layer of a dielectric, and depositing a second layer of an electroconductor on the dielectric layer. In some embodiments, the array of rods or ridges can be made of a photoresist material, and in others, can comprise bonded wires.
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