Polyamide composition for low temperature applications

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United States of America Patent

PATENT NO 9416270
APP PUB NO 20140336317A1
SERIAL NO

14353955

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A polyamide composition is formed from a low viscosity polyamide-6 and a nucleating agent. The nucleating agent includes an organic material, a first inorganic material and a second inorganic material. Suitable organic materials include organic polymers. Suitable inorganic metallic materials include metal oxides and silicates. The polyamide composition may include polyamide-66 materials and carbon black.

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Patent Owner(s)

Patent OwnerAddress
ADVANSIX RESINS & CHEMICALS LLC300 KIMBALL DRIVE SUITE 101 PARSIPPANY NJ 07054

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Huang, Jianfeng Shanghai, CN 44 152
Peng, Shuwen Shanghai, CN 14 54
Wang, Lei Shanghai, CN 2386 21419
Wei, Jie Shanghai, CN 100 1686
Yuan, Jiayu Shanghai, CN 1 4

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