Low temperature curable adhesive compositions
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United States of America Patent
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Aug 16, 2016
Grant Date -
Jan 22, 2015
app pub date -
Oct 7, 2014
filing date -
Jan 16, 2011
priority date (Note) -
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Abstract
The present disclosure is concerned with improved curable adhesive compositions for anchoring elements in a structural body that exhibit low temperature versus standard temperature degree of cures that are at least 50% or higher. The compositions include, in a first portion, a reactive resin, an acetoacetoxy functional monomer and a silane monomer. By using phthalate-free constituents in the formulation, a further 10% increase in strength and durability of the resins at standard temperatures may be realized after curing at low temperatures. Improvements in the adhesive compositions that relate to increased shelf life are also presented.
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