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Abstract

Provided is a lead frame made of a Cu—Fe-based copper alloy strip to improve the heat dissipation in an LED package. An Ag plating reflective film formed on the lead frame enhances the brightness of the LED package. In the Cu—Fe-based copper alloy strip, arithmetic mean roughness Ra is 0.2 μm or less, ten-point mean roughness Rz_JIS is 1.2 μm or less, and maximum height roughness Rz is 1.5 μm or less and depressions having an average length in a rolling parallel direction of 2 to 100 μm, an average length in the rolling vertical direction of 1-30 μm, and a maximum depth along the rolling parallel direction of 400 nm or less. The Cu—Fe-based copper alloy strip contains 1.8-2.6 mass % of Fe, 0.005-0.20 mass % of P, and 0.01-0.50 mass % of Zn or contains 0.01-0.5 mass % of Fe, 0.01-0.20 mass % of P, 0.01-1.0 mass % of Zn, and 0.01-0.15 mass % of Sn.

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First Claim