Low cost interposer and method of fabrication

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9418879
APP PUB NO 20140263582A1
SERIAL NO

13830279

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A method for making an interposer is provided. A conductive layer is formed by contacting a replicate such that a shape of a surface of the conductive layer conforms to a shape of the contacted portion of the replicate. The conductive layer is formed to have a base and a plurality of conductive posts projecting away from the base. Each conductive post is formed to have a post end opposite the base. A dielectric layer is formed to cover the base and to separate adjacent ones of the posts from each other. The posts are for forming vias. Conductive material is removed from the conductive layer to insulate at least one post from at least one other post.

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Patent Owner(s)

  • INVENSAS CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Uzoh, Cyprian Emeka San Jose, US 329 9133

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