Semiconductor chip and semiconductor package
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United States of America Patent
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Aug 16, 2016
Grant Date -
Sep 17, 2015
app pub date -
Feb 27, 2015
filing date -
Mar 12, 2014
priority date (Note) -
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status (Latency Note)
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Abstract
The driver semiconductor package includes a base substrate. The semiconductor package includes a semiconductor chip mounted on the base substrate. The semiconductor chip includes a core region disposed in a center part of the semiconductor chip, an internal circuit being provided in the core region. The semiconductor chip includes a plurality of IO cell regions disposed in a line along a side of the semiconductor chip, a differential circuit being provided in each of the plurality of IO cell regions. The semiconductor chip includes a non-inverting pad electrode disposed above each of the IO cell regions and electrically connected to a non-inverting terminal of the differential circuit. The semiconductor chip includes an inverting pad electrode disposed above each of the IO cell regions and connected to an inverting terminal of the differential circuit.
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