Package-on-package structure including a thermal isolation material and method of forming the same
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United States of America Patent
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Aug 16, 2016
Grant Date -
May 8, 2014
app pub date -
Nov 8, 2012
filing date -
Nov 8, 2012
priority date (Note) -
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Abstract
A semiconductor device includes a first package component and a second package component. The first package component has a first die formed on a first substrate. A second package component has a second die formed on a second substrate. A thermal isolation material is attached on the first die, wherein the thermal isolation material thermally insulates the second die from the first die, and the thermal isolation material has a thermal conductivity of from about 0.024 W/mK to about 0.2 W/mK. A first set of conductive elements couples the first package component to the second package component.
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