Mating interfaces for high speed high density electrical connectors
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United States of America Patent
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Aug 16, 2016
Grant Date -
Sep 25, 2014
app pub date -
Mar 14, 2014
filing date -
Mar 15, 2013
priority date (Note) -
In Force
status (Latency Note)
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Abstract
Mating interfaces for an electrical connector are provided. In some embodiments, a mating interface comprises: a plurality of conductive elements positioned in a plurality of columns, each of the plurality of conductive elements comprising: a sheet of conductive material formed into a three dimensional structure such that the conductive material is disposed on at least two sides of an opening adapted to receive a mating conductive element; and at least one tab cut in the sheet, the at least one tab comprising a mating contact surface facing the opening and adapted to make contact to the mating conductive element.
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